汽车定制 此类器件与标准的 HC405x 和 MC1405xB 模拟多工器/信号分离器器件可实现引脚兼容,但具有注入电流效应控制。因此此类器件尤其适用于汽车应用,其中超过正常逻辑电压的电源非常普遍。注入电流效应控制允许已禁用模拟输入沟道处的信号超过电源电压范围,而不会影响已启用模拟沟道的信号。因此无需外部二极管/电阻网络即可将模拟沟道信号保持在电源电压范围内。此类器件使用低功耗硅门极 CMOS 工艺。沟道选择和启用输入与标准 CMOS 输出兼容。
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MC74HC4852ADR2G
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MC74HC4852ADTR2G
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Die Related Summary Data
Device: MC74HC4852ADG
Equivalent to wafer fab process: CMOS SUB
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平均故障间隔时间/平均无故障时间(按小时计算)
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CMOS SUB
2
920154574
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Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)