This ultrafast rectifier in the dual flag SO−8 flat lead package offersdesigners a unique degree of versatility and design freedom. The twodevices are electrically independent and can be used separately, ascommon cathode, as common anode or in series as a function of boardlevel layout. The exposed pad design provides low thermal resistance.The clip attach design creates a package with very efficient die size toboard area ratio. While thermal performance is nearly the same as theDPAK package height and board footprint are less than half
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