产品说明
The Schottky diode is optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon no lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN style package enables 100 percent utilization of the package area for active silicon offering a significant performance per board area advantage compared to products in plastic molded packages. The low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements.
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优势 |
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Reduces Power Dissipation
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应用 |
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终端产品 |
- LCD and Keypad Backlighting
- Camera Photo Flash
- Buck and Boost DC-DC Converters
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- Reverse Voltage and Current Protection
- Mobile Handsets
- Notebooks, PCs & PDA
- GPS, MP3 Players
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