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Thermal Management What Burns Me Up SEMI-THERM 2013 89.3MB
SPG A Modified MODPLEX Model for MOSFET and Parameter Optimization Using Excel-Based Genetic Algorithm Energy Conversion Congress & Exposition - Denver, CO, USA 2012 867KB
SPG Optimizing Low Side Gate Resistance for Damping Phase Node Ringing of Synchronous Buck Converter Energy Conversion Congress & Exposition - Denver, CO, USA 2012 524KB
Technology Development Development and advantages of an integrated technology monitor. ARCSIS - Rousset, France 2010 28KB
Technology Development Deep trench module optimization for a more robust technology with reduced defect density at lower cost. ARCSIS - Rousset, France 2010 48KB
Technology Development N-Sinker formation by Phosphorous Silicon Glass Diffusion 14th Annual 2011 643KB
Technology Development Development of a Trench isolated 50V technology on an SOI substrate ISPS 2012 2012 464KB
Technology Development Free-charge carrier profile of iso- and aniso-type Si homojunctions determined by terahertz and mid-infrared ellipsometry Thin Solid Films 2011 368KB
Technology Development Power Electronics System Thermal Design APEC 2011 - U.S 2011 2.22MB
Technology Development Capacitive behaviour in Super Junction Trench MOSFET devices Conference on Device Electronics (CDE), Palma, Spain 2011 198KB
DMSG Eliminating a Polysilicon hole defect created during oxide removal ASMC: 16-18 May 2011 at the Saratoga Springs, New York. 2011 363KB
Technology Development Optimization of ONBCD25 Depletion-Mode NLDMOS24V5V Device ISPSD 2011 (San Diego, USA) 2011 449KB
Technology Development Extremely Lightweight X-Ray Optics Based on Thin Substrates SPIE Conference 8076, EUV and X-ray Optics: Synergy between Laboratory and Space/Prague 2011 561KB
SANYO Application of Work Sampling and ECRS (Eliminate, Combine, Re-lay out and Simplify) ASEMEP National Technical Symposium (Philippines) 2011 1.01MB
DMSG Use of Harsh Wafer Probing to Evaluate Various Bond Pad Structures SWTC, Semiconductor Wafer Test Workshop, San Diego, CA, USA 2011 442KB
DMSG Physically Robust Interconnect Design in CUP Bond Pads IMAPS / SEMI ATW on Wire Bonding 2011 197KB
DMSG Use of Harsh Wire Bonding to Evaluate Various Bond Pad Structures EMPC IMAPS Europe confrence on Microelectronics 2011 346KB
Technology Development Laser scribing on SOI wafer Journal of Applied Physics 2010 1.32MB
Technology Development OXYGEN PRECIPITATION IN CZOCHRALSKI SILICON Nuclear Physics B 2007 280KB
Technology Development Optical properties and phase-change transition in Ge2Sb2Te5 flash evaporated thin films studied by temperature dependent spectroscopic ellipsometry Journal of Applied Physics 2008 368KB
Technology Development Design Solutions for Preventing Process Induced ESD Damage during Manufacturing of Interconnects ICICDT 2010 grenoble France 2010 140KB
Technology Development New VDMOS Structure with Discontinuous Thick Inter-Body Oxide to Reduce Gate-to-Drain Charge ISPSD 2010 (Hiroshima) 2010 188KB
Technology Development A LOW SERIES RESISTANCE, HIGH DENSITY, TRENCH CAPACITOR FOR HIGH-FREQUENCY APPLICATIONS Power supply on Chip conference, Cork Ireland 2008 3.68MB
Technology Development MODELING CAPACITANCES OF A VERTICAL RF POWER TRANSISTOR SISPAD - SanDiego 2009 372KB
Technology Development Forward Selection and Best Subset Regression for Semiconductor Yield Enhancement ASMC 2008 2008 76.0KB
APG SENT "New sensor interface" Allows data-transmission at low cost SENSACT 3 2009 / Noisy le Grand • Marne la Vallée France 2009 132KB
Technology Development IMPACT OF VIA INTERACTIONS AND METAL SLOTTING ON STRESS INDUCED Internation Reliability Physics Symposium (IRPS)/Phoenix AZ 2008 324KB
Technology Development A Quality-Cost Model of In-line inspections for excursion detection and reduction Advanced Semiconductor Manufacturing Symposium 2008 232KB
Technology Development Development and advantages of an integrated technology monitor ARCSIS - Rousset, France 2010 28.0KB
Technology Development Deep trench module optimization for a more robust technology with reduced defect density at lower cost ARCSIS - Rousset, France 2010 48KB
Technology Development Gettering capability and structure of polycrystalline silicon layers The 10th Scientific and Business Conference, SILICON 2006, Roznov 2006 128KB
Technology Development Hydrothermal Synthesis of Zinc Oxide Nanowires on Kevlar using ALD and Sputtered ZnO Seed Layers MRS Conference Spring 2009, San Francisco, CA 2009 741KB
Technology Development Investigation of Growth Parameter Influence on Hydrothermally Grown ZnO Nanowires Using a Research Grade Microwave International Semiconductor Device Research Symposium / College Park, MD 2009 559KB
Technology Development Comparison of Gettering Capability of Various Extrinsic Techniques and Enhancement of Gettering Ability of Polycrystalline Silicon Layers The Fifth International Conference on Solid State Crystals and Eighth Polish Conference on Crystal Growth (ICSSC-5 & PCCG-8) 2007 2.05MB
Technology Development Structural changes of polycrystalline silicon layers during high temperature annealing 11th Scientific and Business Conference SILICON 2008 / Roznov p.R. 2008 807KB
Technology Development THERMAL STABILITY OF UNDOPED POLYSILICON LAYERS 19th Development of Materials Science in Research and Education, Zavazna Poruba, Slowakia 2009 100KB
Technology Development STRESS IN THIN FILMS OF POLYCRYSTALLINE SILICON SILICON 2010 / Roznov p. Radhostem, Czech Republic 2010 148KB
Technology Development Residual Stress of Thin Films of Polycrystalline and Amorphous Silicon Development of Materials Science in Research and Education 2010 295KB
Technology Development Using Linear Superposition to solve multiple heat source transient thermal problems InterPack 2007 2007 517KB
Technology Development Diagnostics and troubleshooting of high density plasma process issue causing MIM-Capacitors electrical failures occurred in an automotive ASIC ARCSIS - Rousset, France 2010 44.6KB
Technology Development Simulation of Warpage of Silicon Wafers Using ANSYS® Finite Element Analysis IMAPS 2010 ,Raleigh Convention Center - Research Triangle, North Carolina 2010 211KB
Technology Development Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages EuroSimE conference 2010 410KB
Technology Development Handling, Filtration and Polishing Performance Characterization of Next Generation CMP Slurries Levitronix User's Group 2008 1.11MB
Technology Development Simulation Methods for Predicting Fusing Current and Time for Encapsulated Wire Bonds IMAPS/Research Triangle, North Carolina 2010 560KB
Technology Development Space Optics with Silicon Wafers and Slumped Glass International Conference on Space Optics ICSO2008 2008 720KB
DSP Joint Filterbank Structures for Integrating Audio Coding into Hearing Aid Applications ICASSP 2008 275KB
Power Supply A GPS for the Energy Efficiency Regulation Highway APEC 2008 803KB
DSP Ultra-Low-Power Application Development with RCore C and Assembler AMI Semiconductor Paper 2007 104KB
DSP Low-Power Implementation of an HMM-Based Sound Environment Classification Algorithm for Hearing Aid Application EUSIPCO 2007 173KB
DSP Window Based Prototype Filter Design for Highly Oversampled Filter Banks in Audio Applications ICASSP 2007 421KB
DSP Real-Time Cardiac Arrhythmia Detection Using WOLA Filterbank Analysis of EGM Signals 2007 1MB
Thermal Using Linear Superposition to Solve Multiple Heat Source Transient Thermal Problems InterPACK 2007 921KB
Thermal Electronics System Thermal Design and Characterization InterPACK 2007 3MB
Thermal Efficient Thermal Management of Power MOSFETs, Vital to Improve the Reliability of your Power Conversion Application PCIM Europe 2007 858KB
LED Lighting Driving High Brightness LEDs for Wide Input DC to DC Applications PCIM China 2007 146KB
DSP An Ultra-Low Power Subband-Based Electronic Stethoscope ICASSP 2006 854KB
DSP A High Performance, Low Latency, Low Power Audio Processing System For Wideband Speech Over Wireless Links EUSIPCO 2006 113KB
LED Lighting A Novel Hysteretic Control Circuit PET 2006 708KB
LED Lighting Implementation of compact low cost linear LED driver to replace boost converters for backlighting applications in portable products PET 2006 87KB
Power Supply Inside the Power Supply APEC 2005 3MB
Power Supply 26.1 Bimodal DC-DC Converter With An Efficient Pass-Through Zone APEC 2005 184KB
Power Supply Efficient Architectures for External and Internal Computer Power Supplies APEC 2005 9MB
DSP Low-Power Implementation of a Subband Fast Affine Projection Algorithm for Acoustic Echo Cancellation EUSIPCO 2005 447KB
DSP Low-Resource Delayless Subband Adaptive Filter Using Weighted Overlap-Add EUSIPCO 2005 484KB
DSP System Architecture for Audio Signal Processing in Headsets GSPx 2005 258KB
DSP A Framework for Automatic Generation of Audio Processing Applications on a Dual-core System GSPx 2005 231KB
DSP Partial Update Subband Implementation of Complex Pseudo-affine Projection Algorithm on Oversampled Filterbanks ICASSP 2005 448KB
DSP Complexity Reduction of Partial Update Oversampled Subband Adaptive Algorithms by Selective Pruning of Polyphase Components ICASSP 2005 387KB
Power Supply Simulating Circuits for Power Factor Correction PCIM Germany 2005 181KB
Power Supply The "PWM Switch" Concept included in Mode Transitioning SPICE Models PCIM Germany 2005 48KB
Power Supply The PMODE Technique: Association of Input Power and Output Voltage for closing the Loop in Quasi-Resonant Converter PCIM Germany 2005 42KB
DSP Frequency-Domain Additive Synthesis with an Oversampled Weighted Overlap-Add Filterbank for a Portable Low-Power MIDI Synthesizer AES 2004 104KB
Power Supply A 5-Year Power Technology Roadmap APEC 2004 2MB
Power Supply Driving efficient power solutions from standby to active mode APEC 2004 4MB
Power Supply The Impact of Semiconductor Technology Development on the Power Processing Industry APEC 2004 5MB
Power Supply An Efficient Non-isolated DC-DC Converter and a Review of the More Common Topologies Electronica USA 2004 160KB
LED Lighting Considerations for the Design and Implementation of a Low Cost Integrated Driver for LED's Lighting Applications of Low and High Voltage (6 V – 120 V) Electronica USA 2004 262KB
Power Supply Advantages of a Single Stage PFC+PWM Converter for 75W to 150W DistributedPower Systems Efficiency Analysis of Non-isolated DC DC Converters Electronica USA 2004 486KB
DSP A Polyphase Model for Fast Affine Projection with Partial Filter Update EUSIPCO 2004 324KB
DSP Near-End Distortion in Over-Sampled Adaptive Implementation of Affine Projection Algorithm EUSIPCO 2004 274KB
DSP Sequential LMS for Low-Resource Subband Adaptive Filtering: Oversampled Implementation and Polyphase Analysis EUSIPCO 2004 322KB
DSP An Ultra-Low Power, Miniature System for Detecting and Limiting Acoustic Shock in Headsets GSPx 2004 186KB
DSP Complexity Reduction and Regularization of a Fast Affine Projection Algorithm for Oversampled Subband Adaptive Filters ICASSP 2004 285KB
DSP Ultra Low-Power Sub-Band Acoustic Echo Cancellation for Wireless Headsets ICASSP 2004 199KB
DSP Low-Power Implementation of the Bluetooth Sub-Band Audio Codec ICASSP 2004 285KB
DSP An Acoustic Shock Limiting Algorithm Using Time and Frequency Domain Speech ICSLP 2004 341KB
Protection Zener Diode Based Integrated Filters – An Alternative To Traditional EMI Filter Devices PET 2004 379KB
DSP A Hybrid Subband Adaptive System for Speech Enhancement in Diffuse Noise Fields 2004 367KB
DSP Evaluation of a Hybrid Subband Adaptive System for Noise Reduction in Mobile and Vehicular Applications DSPMVS 2003 304KB
DSP Convergence Improvement for Oversampled Subband Adaptive Noise and Echo Cancellation Eurospeech 2003 225KB
DSP Subband-Based Acoustic Shock Limiting Algorithm on a Low-Resource DSP System Eurospeech 2003 234KB
DSP Affine projection Algorithm for Oversampled Subband Adaptive Filters ICASSP 2003 269KB
DSP ETSI AMR-2 VAD: Evaluation and Ultra Low Resource Implementation ICASSP 2003 186KB
DSP An Efficient Front-End for Automatic Speech Recognition ICECS 2003 184KB
DSP Performance Limitations of a New Subband Adaptive System for Noise and Echo Reduction ICECS 2003 202KB
DSP A Subband Beamformer on an Ultra Low-Power Miniature DSP Platform ICASSP 2002 250KB
DSP An ultra low power, ultra miniature voice command system based on hidden Markov models ICASSP 2002 162KB
DSP Real-time speech synthesis on an ultra low-resource, programmable DSP system ICASSP 2002 160KB
DSP A Low-Resource, Miniature Implementation of the ETSI Distributed Speech Recognition Front-End ICSLP 2002 174KB
DSP Highly oversampled subband adaptive filters for noise cancellation on a low-resource DSP system ICSLP 2002 186KB
DSP An improved wavelet-based speech enhancement system Eurospeech 2001 71KB
DSP Ultra low-power noise reduction strategies using a configurable weighted overlap-add coprocessor ICASSP 2000 60KB
DSP An ultra low-power miniature speech CODEC at 8 kb/s and 16 kb/s ICSPAT 2000 1MB
DSP Embedded ultra low-power digital signal processing 2000 322KB
DSP Efficient sub-band coder implementation for portable low-power applications COST 1999 110KB
DSP A programmable DSP architecture for hearing aids ICSPAT 1999 29KB
DSP An ultra low-power programmable DSP system for hearing aids and other audio applications ICSPAT 1999 86KB
DSP An ultra low-power WOLA filterbank implementation in deep submicron technology ICSPAT 1999 60KB
DSP A Flexible Filterbank Structure for Extensive Signal Manipulations in Digital Hearing Aids ISCAS 1998 87KB
DSP A multi-channel compression strategy for a digital hearing aid ICASSP 1997 407KB
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11.9 Entire Agreement; Amendment; Counterparts; Facsimile Copies. This Agreement, including the Exhibits attached hereto, constitutes the entire agreement and understanding between the parties hereto regarding the subject matter hereof and supersedes all other agreements, understandings, promises, representations or discussions, written or oral, between the parties regarding the subject matter hereof. This Agreement may not be amended except in writing signed by an authorized representative of each of the parties hereto. This Agreement may be executed in counterparts, each of which shall be deemed to be an original, and which together shall constitute one and the same agreement. Each party hereto may deliver an executed copy of this Agreement to the other party via facsimile or other electronic means, and such executed copy(ies) sent/received via facsimile or other electronic means shall be deemed an original and binding copy.

12. Confidentiality. Notwithstanding any terms to the contrary in any non-disclosure agreements between the Parties, Licensee shall treat this Agreement and the Content as ON Semiconductor's "Confidential Information" including: not using the Confidential Information except as expressly set forth herein or otherwise authorized in writing; implementing reasonable procedures to prohibit the disclosure, unauthorized duplication, misuse or removal of the Confidential Information; and not disclosing the Confidential Information to any third party except as may be necessary and required in connection with the rights and obligations under this Agreement and subject to confidentiality obligations at least as protective as those set forth herein, or as otherwise required by law. It is expressly understood that all Confidential Information transferred hereunder, and all copies, modifications, and derivatives thereof, will remain the property of ON Semiconductor, and the Licensee is authorized to use those materials only in accordance with the terms and conditions of this Agreement. Upon termination of this Agreement or upon written request, License shall either return all Confidential Information to ON Semiconductor along with all copies and/or derivatives made, including that on computer databases and copies of portions of the Confidential Information, or destroy all such Confidential Information and certify by written memorandum that all such Confidential Information has been destroyed.

Nothing contained in this Agreement limits a party from filing a truthful complaint, or the party's ability to communicate directly to, or otherwise participate in either: (i) any investigation or proceeding with a United States government agency alleging a securities law violation, waste, fraud, or abuse; or (ii) an investigation or proceeding that is protected under a whistleblower provision of a U.S. federal law or regulation.

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