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产品善用资源项目

安森美半导体致力于为客户提供符合当前及今后业界环境最佳做法的产品。


材料成分

中国RoHS

RoHS

在条目前加~来作精确匹配搜寻 (如 ~NTS2101PT1)



材料公开免责声明

尽管我们已竭尽所能为您提供最准确的信息,但我们不能保证其完整性和准确性,因为数据是依据所提供的范围来汇编的,且其中某些信息因分包商和原材料供应商需要保护他们的专有商业信息或不能提供。

基于上述考虑,本信息仅提供这些器件的估算平均重量和预期的显著有毒重金属成分。这些估计不包括成品硅器件中包含的走线层掺杂物及金属材料。

没有蓄意使用镉,汞,六价铬,多溴联苯(PBBE),多溴联苯醚(PBDE)和四种邻苯二甲酸二(2-乙基己基)邻苯二甲酸二酯(DEHP),邻苯二甲酸丁基苄酯(BBP),邻苯二甲酸二丁酯( DBP),邻苯二甲酸二异丁酯(DIBP)(10种RoHS禁用物质中的9种)在此或我们任何的其他产品中。

如欲了解有关材料成分计算的更详细解释,请查看我们的《产品化学成分手册》。



无铅引脚镀层



无卤素(Halogen Free, HF) / (绿色环保)产品

安森美半导体根据IEC 61249-2-21定义的 “绿色环保”产品为无卤素:

安森美半导体自成立以来就根据上述定义提供无卤素DFN/QFN封装系列。如今我们大多数的产品都无卤素。所有无卤素封装的产品都符合安森美半导体严格的及业界公认的质量、可靠性和封装强固性准则。选择无卤素模子化合物及裸片粘接材料时还考虑要求数量的商业供货保证和稳定的可制造性表现。安森美半导体无卤素可按日期编码和工厂地点来追踪。





付运/标记/标签信息

按照JEDEC标准JESD97的标签要求,中间包装和外包装盒上所有的标准付运标签都需清楚列明内装产品是否符合RoHS /无铅。定制的付运标签也需清楚地做标记。2LI 代表第二级互连而且正式表明引脚镀层不含铅。e类别表示引脚镀层材料。

条形码标签上的标记表示无铅引脚镀层以及经认证符合无铅板贴装封装的工艺。卷轴、管状或条状以及中间包装上的生产商器件型号(MPN)条形码标签有符合JEDEC 标准 JESD97的无铅符号。

条形码标签还包括RoHS = Y (Yes)称号以及无铅2LI图标。这称号为了避免产品是否符合RoHS方面的混淆。 对于安森美半导体,符合RoHS就相等于无铅。但是,我们认识到在业内不是这种情况,所以我们包括了两种称号。2006年第3季度发布之前印刷的条形码标签将只保持无铅2LI 图标称号。

所有后缀为G的器件型号为无铅2LI 并符合RoHS要求。

除了满足RoHS 标准以外,安森美半导体产品还符合中国版RoHS 报告标准。为了遵从中国RoHS指令,自2007年3月开始,我们的出货标签包括有害物质内容的附加信息。安森美半导体封装标签进行修改,包括中国RoHS新要求的符号。带有Green circle e imageNo PB image符号表示整个元件真正无铅。如果元件含铅,无论是在端子镀层,还是在祼片粘接中,都会在其标签上增加Orange circle 50 image符号。元件标签上有No PB image RoHS=Y 和Orange circle 50 image符号的,表示端子镀层是无铅的,但是祼片粘接中含铅。有含铅端子镀层的元件标签现在也有Orange circle 50 image符号。

所有可订购的安森美半导体器件和根器件型号(包括本站“中国 RoHS”链接中的裸片销售)都提供中文版材料成分表。此链接还提供关于中国RoHS 指令的更多信息。

新型封装标签示例

器件包含无铅端子镀层,且整个元件采用无铅。完全符合Pb-free、RoHS 指令及中国 RoHS 指令。

器件包含无铅端子镀层,但有含铅的裸片粘接。完全符合无Pb-free及RoHS要求,并根据中国 RoHS 指令采用 50 标志。

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