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ON Semiconductor Demonstrates High Efficiency 3D Sensor Stacking Technology   Chinese Japanese Korean

CMOS image sensor technology delivers improved power, performance and size efficiency for future ON Semiconductor sensors for mobile and consumer applications















Consumer Electronics Show (CES) – LAS VEGAS, Nevada – Jan. 5, 2015 - ON Semiconductor (Nasdaq: ONNN), driving energy efficient innovations, has successfully characterized and demonstrated its first fully-functional stacked CMOS imaging sensor featuring a smaller die footprint, higher pixel performance and better power consumption compared to traditional monolithic non-stacked designs. The technology has been successfully implemented and characterized on a test chip with 1.1-micron (µm) pixels and will be introduced in a product later this year.

Conventional sensor designs in a monolithic substrate process require separate die area to support both the pixel array and supporting circuitry. With 3D stacking technology, the pixel array and the supporting circuitry are manufactured on separate substrates and then stacked with connections between the two made with through silicon vias (TSVs). This allows the pixel array to overlay the underlying circuitry and result in a more efficient die floorplan. With this approach, design engineers can optimize each part of the sensor for imaging performance, cost, power and die size. With the optimization of the pixel array, sensors can have improved pixel performance with lower noise levels and enhanced pixel response. The underlying circuitry can use more aggressive design rules to lower power consumption as well. The smaller overall footprint supports today’s advanced camera modules that integrate Optical Image Stabilization (OIS) and additional data storage in the same module footprint.

“3D stacking technology is an exciting breakthrough that enhances our ability to optimize ON Semiconductor’s future sensors,” said Sandor Barna, vice president of Technology for ON Semiconductor’s Image Sensor Group. “This technology provides manufacturing and design flexibility to ensure continued performance leadership across our entire sensor product portfolio.”

ON Semiconductor will be demonstrating its latest image sensor technology and products at CES 2015 in Las Vegas from Jan. 6-8. To schedule a private tour of the company’s live image sensor demonstrations please contact your ON Semiconductor sales representative.

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关于安森美半导体
安森美半导体(ON Semiconductor,美国纳斯达克上市代号:ONNN)致力于推动高能效电子的创新,使客户能够减少全球的能源使用。公司全面的高能效电源和信号管理、逻辑、分立及定制方案阵容,帮助工程师解决他们在汽车、通信、计算机、消费电子、工业、LED照明、医疗、军事/航空及电源应用的独特设计挑战。公司运营敏锐、可靠、世界一流的供应链及品质项目,及在北美、欧洲和亚太地区之关键市场运营包括制造厂、销售办事处及设计中心在内的业务网络。更多信息请访问http://www.onsemi.cn

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安森美半导体和安森美半导体图标是 Semiconductor Components Industries, LLC的注册商标。所有本文中出现的其它品牌和产品名称分别为其相应持有人的注册商标或商标。虽然公司在本新闻稿提及其网站,但此稿并不包含其网站中有关的信息。