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产品更改通知 搜寻结果

Part Number = BAT54

产品变更通告#

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20774Z Henkel Green Compound Qual for SC88, SC88A, SC70, SC74, SC75, SOD923 pkgs 2015-03-04 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20425Z SOD-123 package/devices qualification for assembly & test in Leshan, China 2015-01-07 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20425 Final Notification of SOD-123 package/devices qualification for assembly & test in Leshan, China 2014-08-29 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20425A Final Notification of SOD-123 package/devices qualification for assembly & test in Leshan, China 2014-08-29 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16837 1Q2012 – Update Notice for the reactivation of previously discontinued parts 2012-04-02 UPDATE NOTIFICATION View PDF
16673 2Q11 (2nd QUARTER 2011) Product Discontinuance Notice 2011-06-30 PRODUCT DISCONTINUANCE View PDF
16583 1Q2011 – Update Notice for the reactivation of previously discontinued parts 2011-04-08 UPDATE NOTIFICATION View PDF
16547O Copper Wire replacing Gold Wire in the SOT563, SOT553, SOT223(Soft Solder), SOD323, SC88, SC89, SOT723, SOD923, SOT963, SOT953 and SOT1123 packages 2010-12-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16538 Special Leaded Product Discontinuance Notice 2010-11-23 PRODUCT DISCONTINUANCE View PDF
16498 2Q10 2nd QUARTER 2010 Product Discontinuance Notice 2010-07-07 PRODUCT DISCONTINUANCE View PDF
16469 Initial Notification for SOD123 assembly in ON Leshan as 2nd source 2010-05-26 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16478O Copper Wire replacing Gold Wire in the SOT23, SC88/SC88A, SC70, SC74, SC75, SOD123, SOD523, SOD723, SOT723, SOD923 Packages. 2010-05-19 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16452 1Q10 Product Discontinuance Notice 2010-04-14 PRODUCT DISCONTINUANCE View PDF
16389 4Q09 (4th QUARTER 2009) Product Discontinuance Notice 2010-01-21 PRODUCT DISCONTINUANCE View PDF
16350 Final Notification for Transfer of Small Signal Schottky and Bidirectional ESD Diodes from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) 2009-11-02 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16352 Copper Wire replacing Gold Wire in the SOT23, SC59, SC70, SC74, SC75 and SC88 Packages 2009-10-29 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16266 Copper Wire replacing Gold Wire in the SOT23, SOD123, SOD323, TSOP6, SOT223, and SC88/SC88A Packages 2009-06-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16250 Initial Notification of Transfer of EMI Filters, Bidirectional ESD Diodes, Bipolar Power, Bidirectional TVS (Transient Voltage Suppressor) Diodes, TVS (Transient Voltage Suppressor) Arrays, Small Signal Schottky, Ultrafast Rectifier and Thyristor Surge Protection Devices (TSPD) products from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) 2009-04-29 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16134 SOT-23 Possible Adhesion Issue using Glue Mount Process 2008-07-11 PRODUCT BULLETIN View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
16004 H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2007-06-27 PRODUCT DISCONTINUANCE View PDF
15694 4Q06 Product Discontinuance Notice 2007-01-02 PRODUCT DISCONTINUANCE View PDF
15645 3rd QUARTER 2006 Product Discontinuance Notice 2006-10-06 PRODUCT DISCONTINUANCE View PDF
15590 2Q06 (2nd QUARTER 2006) Product Discontinuance Notice 2006-06-30 PRODUCT DISCONTINUANCE View PDF
15573 Final Notification for manufacturing expansion to Leshan China for the SC74 & SC75 packages 2006-06-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15503 1QO6 (1st QUARTER 2006) Product Discontinuance Notice 2006-04-12 PRODUCT DISCONTINUANCE View PDF
15314 Initial Notification of the manufacturing expansion to Leshan, China for the SC74 & SC75 packages 2006-02-03 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15006 Intrinsic Lead (Pb) Free Product Part Number Change 2005-08-30 PRODUCT BULLETIN View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12898 Qualification of Additional Assembly/Test Site for ON Semiconductor Devices Packaged in SC70 2003-07-11 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12287 Final Notification for Small Signal Schottky Process Consolidation in Zener Rectifier Wafer Fab 2003-06-24 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12926 MODIFICATION OF PCN # 12797, PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-05-27 UPDATE NOTIFICATION View PDF
12797 PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-04-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10216 SOT23 Assembly/Test Transfer to LPS 2000-07-31 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10148 HYSOL Molding Compound and AFW(American Fine Wire) Change 2000-03-17 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4952 SOD-123 Silver Strip Leadframe Elimination 1999-07-30 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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