产品更改通知
| Change Notification # |
|
20233 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT BULLETIN |
| Change Title |
|
Change SOD123-FL Package Maximum Height |
| Issue Date |
|
2013-09-13 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor is notifying customers of its plan to change the maximum height of SOD-123FL package from 1mm to 0.98mm at SBN, Malaysia manufacturing site.
The mold compound, die attach, and lead frame materials used in the SOD-123FL package will remain the same. Qualification was done and CPK calculated to be passing for the new package height limit.
|
| Key Items Affected by Change |
|
ON Semiconductor Assembly BE Equipment |
| |
| Key Milestones |
|
| Effective Date: |
|
2013-09-13 |
| Sample Info: |
|
Contact your local ON Semiconductor sales office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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|