硅光电倍增阵列,C 系列 (SiPM)

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C 系列 SiPM 传感器 4 面可扩展阵列 安森美半导体的 C 系列硅光电倍增 (SiPM) 传感器用于生产紧凑的可扩展阵列。采用 MLP 封装的此类传感器安装在具有最小死区空间的 PCB 板上,可提供多种形式,可由 1 mm、3 mm 或 6 mm 传感器组成。每个 ArrayC 的背面都具有多路联接器或球形焊点阵列 (BGA),提供对于快速*和标准输出的访问,以及来自像素总和基质的公共 I/O。 * 请注意 ARRAYC-60035-4P-BGA 没有快速输出。

  • Medical Imaging
  • Hazard & Threat
  • 3D Ranging & Sensing
  • Biophotonics & Sciences
  • High Energy Physics
  • 4-Side scalable arrays
  • Variety of formats ranging from 2×2 to 12×12
  • Minimal deadspace at the edges allowing tiling on all sides to allow the creation to still larger detection areas
  • Each array has either a multi-way connector or BGA on the reverse for access to all signals
  • The pixel signals can either be read out individually for imaging applications, or summed by the user to create a large area, single-channel sensor
  • The pixel-level performance is exactly as per that of the individual C-Series sensors
  • Optional evaluation boards for are available for easy access to signals

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ARRAYC-30035-144P-PCB

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CAD Model

Pb

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ARRAYC-300XX-144P-PCB

1

260

UNTBX

1

Y

Array

12 x 12

3 mm x 3 mm

35

420

41

30

Price N/A

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ARRAYC-30035-16P-PCB

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CAD Model

Pb

A

H

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ARRAYC-300XX-16P-PCB

1

260

UNTBX

1

Y

Array

4 x 4

3 mm x 3 mm

35

420

41

30

Price N/A

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ARRAYC-60035-4P-BGA

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CAD Model

Pb

A

H

P

ARRAYC-600XX-4P-BGA

1

260

UNTBX

1

Y

Array

2 x 2

6 mm x 6 mm

35

420

41

30

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ARRAYC-60035-64P-PCB

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CAD Model

Pb

A

H

P

ARRAYC-600XX-64P-PCB

1

260

UNTBX

1

Y

Array

8 x 8

6 mm x 6 mm

35

420

41

30

Price N/A

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