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C 系列 SiPM 传感器 4 面可扩展阵列 安森美半导体的 C 系列硅光电倍增 (SiPM) 传感器用于生产紧凑的可扩展阵列。采用 MLP 封装的此类传感器安装在具有最小死区空间的 PCB 板上,可提供多种形式,可由 1 mm、3 mm 或 6 mm 传感器组成。每个 ArrayC 的背面都具有多路联接器或球形焊点阵列 (BGA),提供对于快速*和标准输出的访问,以及来自像素总和基质的公共 I/O。 * 请注意 ARRAYC-60035-4P-BGA 没有快速输出。
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CAD Models
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Package Type
Case Outline
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Container Qty.
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Array Format
Active Area Dimensions
Microcell Size (µm)
Optimized Wavelength (nm)
PDE @ Max Overvoltage (%)
DCR @ Typical Overvoltage (KHz/mm2)
Reference Price
ARRAYC-30035-144P-PCB
Active
Pb
A
H
P
ARRAYC-300XX-144P-PCB
1
260
UNTBX
1
Y
Array
12 x 12
3 mm x 3 mm
35
420
41
30
Price N/A
More Details
ARRAYC-30035-16P-PCB
Active
Pb
A
H
P
ARRAYC-300XX-16P-PCB
1
260
UNTBX
1
Y
Array
4 x 4
3 mm x 3 mm
35
420
41
30
Price N/A
More Details
ARRAYC-60035-4P-BGA
Active
Pb
A
H
P
ARRAYC-600XX-4P-BGA
1
260
UNTBX
1
Y
Array
2 x 2
6 mm x 6 mm
35
420
41
30
Price N/A
More Details
ARRAYC-60035-64P-PCB
Active
Pb
A
H
P
ARRAYC-600XX-64P-PCB
1
260
UNTBX
1
Y
Array
8 x 8
6 mm x 6 mm
35
420
41
30
Price N/A
More Details
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