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Low rs characteristics is enable to use high frequency applications. This PIN diode is designed to realize compact and efficient designs. NSDP301MX3 in a X3DFN2 miniature package enablesdesigners to meet the challenging task of achieving higher efficiency and meeting reduced space requirements. In addition, wettable flank package improves the quality at mounted to PCB.
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NSDP301MX3T5G
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可靠性数据
Die Related Summary Data
Device: NSDP301MX3T5G
Equivalent to wafer fab process: SSD
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等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
SSD
0
6889897810
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Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)