封装图纸
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按文档类型:
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封装图纸 用于
Current Protection
(显示所有)
页面尺寸:
1 - 13 of 13
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1
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| DFN10, 3x3, 0.5P |
485C (32.8kB) |
D |
| DFN8 3x3, 0.65P |
506BW (55.8kB) |
O |
| LLGA12 3x3, 0.5P |
513AK (44.5kB) |
O |
| SOIC-8 |
751AZ (37.1kB) |
B |
| SOIC-8 Narrow Body |
751-07 (62.6kB) |
AK |
| TDFN8, 2x3, 0.5P |
511AK (34.2kB) |
B |
| TLLGA12 4x4, 0.5P |
513AP (54.1kB) |
O |
| TSOP-5 |
483 (58.0kB) |
K |
| TSOP-6 |
318G-02 (64.1kB) |
V |
| TSSOP 8 LEAD 3.0x4.4x1.1 mm |
948S-01 (70.3kB) |
C |
| TSSOP-20 EP, 6.5x4.4 |
948AB (70.4kB) |
O |
| UDFN10, 3.3, 0.5P (lead 2& 3 Tied) |
517CC (63.0kB) |
O |
| UDFN6, 2x2, 0.65P |
517AB (60.5kB) |
C |
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