封装图纸
|
按文档类型:
|
|
- 或 - |
|
|
|
封装图纸 用于
ECLinPS Plus
(显示所有)
页面尺寸:
1 - 11 of 11
[
1
]
|
|
|
|
| C/O FOR MICRO 10 PKG |
846B (30.6kB) |
D |
| DFN8 2.0x2.0x0.9mm, 0.5p |
506AA (58.5kB) |
E |
| LQFP-64 |
848G (191.6kB) |
A |
| QFN16, 3x3, 0.5P |
485G-01 (57.3kB) |
F |
| QFN20, 4x4, 0.5P |
485E-01 (60.9kB) |
B |
| QFN24, 4x4, 0.5P |
485L-01 (60.0kB) |
B |
| QFN32, 5x5, 0.5P, 3.1x3.1EP |
488AM (57.4kB) |
A |
| SOIC-20 WB |
751D-05 (36.3kB) |
H |
| SOIC-8 Narrow Body |
751-07 (62.6kB) |
AK |
| TSSOP 20 LEAD |
948E-02 (46.9kB) |
C |
| TSSOP 8 3.0x3.0x0.95 mm |
948R-02 (77.3kB) |
A |
|
|
|