封装图纸
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按文档类型:
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封装图纸 用于
Voltage Protection
(显示所有)
页面尺寸:
1 - 22 of 22
[
1
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| DFN6 2x1.6, 0.5P |
506BM (59.2kB) |
O |
| DFN8 2.0x2.2, 0.5P |
506BP (61.7kB) |
A |
| HMSOP8 (150mil) |
846AF (55.3kB) |
O |
| LLGA10, 2.5x2.5, 0.5P |
513AG (45.3kB) |
A |
| LLGA12 3x3, 0.5P |
513AK (44.5kB) |
O |
| LLGA8, 3x2.5x0.65P |
517AH (32.9kB) |
A |
| Micro8 / MSOP8 (150 mil) |
846AH (57.4kB) |
A |
| QFN22, 3x4, 0.5P |
485AT (62.7kB) |
B |
| SC-74 (SC-59ML) 6 LEAD |
318F-05 (55.9kB) |
N |
| SOIC-8 Narrow Body |
751-07 (62.6kB) |
AK |
| TLLGA12 4x4, 0.5P |
513AP (54.1kB) |
O |
| TSOP-5 |
483 (58.0kB) |
K |
| TSOP-6 |
318G-02 (64.1kB) |
V |
| UDFN10 2.5x2, 0.5P |
517AV (66.6kB) |
A |
| UDFN6, 2x2, 0.65P |
517AB (60.5kB) |
C |
| WDFN10, 2.5x2 mm, 0.5P |
516AA (43.1kB) |
C |
| WDFN6 2.6x4, 0.65P, Dual Flag |
511BZ (31.0kB) |
A |
| WDFN6 2x2, 0.65P |
506AN (64.1kB) |
G |
| WLCSP6 1.31x1.04 |
499BP (53.9kB) |
A |
| WLCSP6 1.31x1.04 |
567JW (29.5kB) |
O |
| WQFN32 4.4x4.4, 0.4P |
485BN (58.4kB) |
O |
| Wafer Level Chip Scale Pa |
567JM (31.5kB) |
A |
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