Evaluation Kit | ARRAYX-BOB6-64S-GEVK

The ArrayX-BOB6-64S is an evaluation board allowing easy access to the sum of all of standard pixel signals of a SensL ArrayJ- 60035-64P, 6 mm 8 x 8 TSV array, in addition to all of the individual fast output signals. The Breakout Board features two Samtec 80-way connectors, type QSE-040-01-F-D-A. These connectors mate with the Samtec QTE-040-03-F-D-A board-to-board connector on the array. Since the connectors are keyed, orientating the array on the BOB is straightforward. A schematic of the board is shown in Figure 4 below.
Fast signals: All of the fast output signals (Fn) from the array are routed via the mating connectors to header pins. These pins are formed of four 50-way (25 x 2 row) 2.54 mm pitch headers; J3, J4, J5 and J6. Each of the four headers also has 10 pins that connect to the common cathode (CM) and 8 pins left unconnected (NC) to allow prototyping for evaluation purposes.
Two SMA connectors and Balun transformers are provided with 4-pin headers to allow any fast signal to be connected directly to the SMA or via the transformer using jumper wires.
Summed output: A summed output (the anodes of pixels 1 to 64 connected together) is routed to jumper pins (SM) in close proximity to a third SMA connector. Four 7 mm holes are placed on a 25 mm grid to allow mounting of the board on an optical breadboard.