General Purpose and Low VCE(sat) Transistors | BSS64L

NPN 双极小信号晶体管

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概览

该 NPN 双极晶体管适用于线性和开关应用。此器件采用 SOT-23 封装，适合低功率表面贴装应用。

  • The SOT-23 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die
  • Available in 12 mm Tape and Reel Use BSP52T1 to order the 7 inch/1000 unit reel Use BSP52T3 to order the 13 inch/4000 unit reel
  • PNP Complement is BSP62T1
  • Pb-Free Package is Available

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Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Polarity

Type

VCE(sat) Max (V)

IC Cont. (A)

VCEO Min (V)

VCBO (V)

VEBO (V)

VBE(sat) (V)

VBE(on) (V)

hFE Min

hFE Max

fT Min (MHz)

PTM Max (W)

Reference Price

BSS64LT1

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Obsolete

CAD Model

Pb

A

H

P

SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P

318

1

235

REEL

3000

N

-

General Purpose

0.2

0.1

80

-

-

-

-

20

-

60

0.225

Price N/A

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BSS64LT1G

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CAD Model

Pb

A

H

P

SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P

318

1

260

REEL

3000

N

NPN

General Purpose

0.2

0.1

80

120

5

-

-

20

-

60

0.225

$0.0223

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可靠性数据

Die Related Summary Data

Device: BSS64LT1G

Equivalent to wafer fab process: SST

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等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

SST

0

4654891639

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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