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HGTD1N120BNS9A 基于非穿通型(NPT)IGBT 设计。 IGBT非常适合许多在中等频率下运行、非常需要低传导损耗的高压开关应用,例如UPS、光伏逆变器、电机控制和电源。
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CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Family
V(BR)CES Typ (V)
IC Max (A)
VCE(sat) Typ (V)
VF Typ (V)
Eoff Typ (mJ)
Eon Typ (mJ)
Trr Typ (ns)
Irr Typ (A)
Gate Charge Typ (nC)
Short Circuit Withstand (µs)
EAS Typ (mJ)
PD Max (W)
Co-Packaged Diode
Reference Price
HGTD1N120BNS9A
Active
Pb
A
H
P
DPAK-3 / TO-252-3
1
260
REEL
2500
N
-
1200
2.7
2.5
-
0.09
0.07
-
-
14
8
10
60
No
$0.6237
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可靠性数据
Die Related Summary Data
Device: HGTD1N120BNS9A
Equivalent to wafer fab process: IGBT
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
IGBT
1
2930462991
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)