IGBTs | AFGB30T65SQDN

IGBT 650V FS4 高速版，适用于 OBC 应用，D2PAK 封装

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概览

采用新型场截止第 4 代 IGBT 技术且通过了 AEC-Q101 认证。AFGB30T65SQDN 具有最佳性能以及低导通损耗和开关损耗，可在各种应用中实现高效运行。

  • Automotive On Board Charger
  • Automotive DC/DCC converter for HEV
  • EV/PHEV
  • AEC-Q101 Qualified
  • VCE(sat) = 1.6 V (typ.) @ IC = 30 A
  • Low VF soft recovery co-packaged diode

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可靠性数据

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状态

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Compliance

Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Family

V(BR)CES Typ (V)

IC Max (A)

VCE(sat) Typ (V)

VF Typ (V)

Eoff Typ (mJ)

Eon Typ (mJ)

Trr Typ (ns)

Irr Typ (A)

Gate Charge Typ (nC)

Short Circuit Withstand (µs)

EAS Typ (mJ)

PD Max (W)

Co-Packaged Diode

参考价格

AFGB30T65SQDN

联系销售

量产中

CAD Model

Pb

A

H

P

D2PAK-3 / TO-263-2

418AJ

1

260

REEL

800

Yes

-

650

30

1.6

1.5

0.16

0.786

131

-

56

-

-

220

Yes

$2.2571

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可靠性数据

Die Related Summary Data

Device: AFGB30T65SQDN

Equivalent to wafer fab process: TRENCH IGBT

产品技术

产品技术

等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

TRENCH IGBT

0

11285217884

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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