IGBTs | PCRKA30065F8M1

Extremefast (EF) diode, 650 V, 300 A Bare Die with Solderable Top Metal. Pairing with PCGA300T65DF8M1

Obsolete

数据表

产品

概览

This 650V Extremefast (EF) diode Bare Die has a die size of 10mm x 7.2mm. Its anode pad (top side) is covered with Ni/Ag solderable top metal, which enables advanced power module assembly technologies for top side connection, including Ag Sintering and Cu bare soldering, etc.

  • Automotive Traction Modules
  • General Power Modules

  • xEV

  • AEC-Q101 Qualified
  • Maximum Junction Temperature 175°C
  • Low Forward Voltage (VF = 1.2 V (Typ.) @ IF = 300 A)
  • Extremefast Technology with soft recovery
  • Final Solderable Metal Layer

Tools and Resources

Product services, tools and other useful resources related to PCRKA30065F8M1

CAD Model

CAD模型

物质成分

产品更改通知

可靠性数据

产品列表

如需购买产品或样品，请先登录您的安森美账号。

搜寻

Close Search

产品:

0

分享

排序方式

产品系列:

┗

可订购器件:

0

产品

状态

CAD Models

Hmmm...
We're sorry, we couldn't find any matches for that search term.
Double check your search for any typos or spelling errors or try a different search term.

Show More

1-25 of 25

Products per page

Jump to :

1
contact sales icon

Support on the go

Find and compare products, get support and connect with onsemi sales team.

可靠性数据

Die Related Summary Data

Device: PCRKA30065F8M1

Equivalent to wafer fab process: IGBT

产品技术

产品技术

等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

IGBT

1

2930462991

More Details

Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

重新搜寻