IGBTs | PCRKA30065F8M1

Extremefast (EF) diode, 650 V, 300 A Bare Die with Solderable Top Metal. Pairing with PCGA300T65DF8M1

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This 650V Extremefast (EF) diode Bare Die has a die size of 10mm x 7.2mm. Its anode pad (top side) is covered with Ni/Ag solderable top metal, which enables advanced power module assembly technologies for top side connection, including Ag Sintering and Cu bare soldering, etc.

  • Automotive Traction Modules
  • General Power Modules

  • xEV

  • AEC-Q101 Qualified
  • Maximum Junction Temperature 175°C
  • Low Forward Voltage (VF = 1.2 V (Typ.) @ IF = 300 A)
  • Extremefast Technology with soft recovery
  • Final Solderable Metal Layer

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可靠性数据

Die Related Summary Data

Device: PCRKA30065F8M1

Equivalent to wafer fab process: IGBT

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平均故障间隔时间/平均无故障时间（按小时计算）

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1

2930462991

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Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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