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此类 N 和 P 沟道 2.5V 指定 MOSFET 是使用先进的 PowerTrench 工艺生产的,特别适用于最大程度降低导通电阻,同时保持低门极电荷,实现卓越的开关性能。此类器件适用于无法采用更昂贵的 SO-8 和 TSSOP-8 封装的应用,可为其在非常小的占地面积中提供卓越的功率耗散。
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可订购器件:
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产品
状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Channel Polarity
Silicon Family
Package Name
Type
Gate Level
Wide SOA Mosfets
Configuration
OPN in older Technology
V(BR)DSS Min (V)
RDS(on) Max @ VGS = 10 V (mΩ)
VGS Max (V)
Vgs(th) Max (V)
Id Max (A)
PD Max (W)
RDS(on) Max @ VGS = 2.5 V (mΩ)
RDS(on) Max @ VGS = 4.5 V (mΩ)
Qg Typ @ VGS = 4.5 V (nC)
Qg Typ @ VGS = 10 V (nC)
Ciss Typ (pF)
Qgd Typ @ VGS = 4.5 V (nC)
Qrr Typ (nC)
Coss Typ (pF)
Crss Typ (pF)
Reference Price
FDC6327C
Active
Pb
A
H
P
TSOT-23-6
1
260
REEL
3000
Y
Complementary
PowerTrench® T1
SC-6
Small Signal
Logic
0
Dual
0
±20
-
8
±1.5
N:2.7 , P: -1.6
0.96
N:120, P:250
N: 80, P: 170
3.7
2.85
315
N: 0.9, P: 0.65
-
-
-
$0.1629
More Details
FDC6327C-F169
Obsolete
Pb
A
H
P
TSOT-23-6
1
260
REEL
3000
N
Complementary
PowerTrench® T1
NA
Small Signal
Logic
0
Dual
0
20
250
-
8
-1.9
0.96
N:120 P:250
N: 80, P: 170
2.85
2.85
325
0.9
-
N: 75, P: 65
N: 35, P: 24
Price N/A
More Details
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可靠性数据
Die Related Summary Data
Device: FDC6327C
Equivalent to wafer fab process: TR
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
TR
1
1603286882
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)