方案
By Technology
此器件专门设计为手机和其他移动应用中 DC/DC 开关 MOSFET 的单封装解决方案。它具有一个独立的 N 沟道和 P 沟道 MOSFET,且具有低导通电阻,可实现最低的导电损耗。每个 MOSFET 的门极电荷也得以最大程度降低,可实现直接在控制设备中进行高频控制。MicroFET 1.6x1.6 薄封装对于其物理尺寸来说提供了卓越的热性能,非常适合开关和线性模式应用。
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CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Channel Polarity
Silicon Family
Package Name
Type
Gate Level
Wide SOA Mosfets
Configuration
OPN in older Technology
V(BR)DSS Min (V)
RDS(on) Max @ VGS = 10 V (mΩ)
Vgs (V)
Vgs(th) Max (V)
ID Max (A)
PD Max (W)
RDS(on) Max @ VGS = 2.5 V (mΩ)
RDS(on) Max @ VGS = 4.5 V (mΩ)
Qg Typ @ VGS = 4.5 V (nC)
Qg Typ @ VGS = 10 V (nC)
Ciss Typ (pF)
Qgd Typ @ VGS = 4.5 V (nC)
Qrr Typ (nC)
Coss Typ (pF)
Crss Typ (pF)
Reference Price
FDME1034CZT
Active
Pb
A
H
P
UDFN-6
1
260
REEL
5000
Y
Complementary
PowerTrench® T1
Power 22
Low-Medium Voltage
Logic
0
Dual
0
±20
-
8
±1
N: 2.8, P: -2.6
1.4
N:86, P: 213
N: 66, P: 142
-
5.5
305
-
-
-
-
$0.1996
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可靠性数据
Die Related Summary Data
Device: FDME1034CZT
Equivalent to wafer fab process: T5,TV
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
T5,TV
0
99806707
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)