Low/Medium Voltage MOSFETs | FDMS8320LDC

N 沟道双 CoolTM 56 Power Trench® MOSFET 40V，192A，1.1mΩ

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此 N 沟道 MOSFET 采用先进的 PowerTrench® 工艺生产。同时结合了硅和 Dual Cool™ 封装技术的发展进步，可提供最低的 rDS(on)，同时利用极低的结到环境热阻保持出色的开关性能。

  • 发电和配电

  • rDS(on)最大值 = 1.1 mΩ，需 VGS = 10 V、ID = 44 A
  • rDS(on)最大值 = 1.5 mΩ，需 VGS = 4.5 V、ID = 37 A
  • 先进的封装技术和硅技术相结合，实现了低 rDS(on) 和高效率
  • 下一代增强型体二极管技术，专为软恢复设计
  • MSL1 耐用封装设计
  • 100%经过UIL测试
  • 符合 RoHS 标准

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状态

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Compliance

Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Channel Polarity

Silicon Family

Package Name

Type

Gate Level

Wide SOA Mosfets

Configuration

OPN in older Technology

V(BR)DSS Min (V)

RDS(on) Max @ VGS = 10 V (mΩ)

Vgs (V)

Vgs(th) Max (V)

ID Max (A)

PD Max (W)

RDS(on) Max @ VGS = 2.5 V (mΩ)

RDS(on) Max @ VGS = 4.5 V (mΩ)

Qg Typ @ VGS = 4.5 V (nC)

Qg Typ @ VGS = 10 V (nC)

Ciss Typ (pF)

Qgd Typ @ VGS = 4.5 V (nC)

Qrr Typ (nC)

Coss Typ (pF)

Crss Typ (pF)

Reference Price

FDMS8320LDC

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CAD Model

Pb

A

H

P

DFN-8

506EG

1

260

REEL

3000

Y

N-Channel

PowerTrench® T1

Power 56 Dual Cool

Low-Medium Voltage

Logic

0

Single

0

40

1.1

±20

3

192

125

-

1.5

-

57

8310

16

89

2255

132

$0.9341

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可靠性数据

Die Related Summary Data

Device: FDMS8320LDC

Equivalent to wafer fab process: RN

产品技术

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等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

RN

9

5181260142

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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