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此 N 沟道 MOSFET 使用先进的 PowerTrench® 工艺生产。同时结合了硅和 Dual Cool™ 封装技术的发展,可提供最低的 rDS(on),因为具有极低的结到环境热阻,同时可保持卓越的开关性能。
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CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Channel Polarity
Silicon Family
Package Name
Type
Gate Level
Wide SOA Mosfets
Configuration
OPN in older Technology
V(BR)DSS Min (V)
RDS(on) Max @ VGS = 10 V (mΩ)
Vgs (V)
Vgs(th) Max (V)
ID Max (A)
PD Max (W)
RDS(on) Max @ VGS = 2.5 V (mΩ)
RDS(on) Max @ VGS = 4.5 V (mΩ)
Qg Typ @ VGS = 4.5 V (nC)
Qg Typ @ VGS = 10 V (nC)
Ciss Typ (pF)
Qgd Typ @ VGS = 4.5 V (nC)
Qrr Typ (nC)
Coss Typ (pF)
Crss Typ (pF)
Reference Price
FDMT800152DC
Active
Pb
A
H
P
PQFN-8
1
260
REEL
3000
Y
N-Channel
PowerTrench® T1
Power 88 Dual Cool
Low-Medium Voltage
Standard
0
Single
0
150
9
±20
4
72
156
-
-
9
38
4196
12
187
379
16
$2.875
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可靠性数据
Die Related Summary Data
Device: FDMT800152DC
Equivalent to wafer fab process: RN
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
RN
9
5181260142
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)