FDZ391P

-20V P沟道1.5 V PowerTrench®薄型WL-CSP MOSFET

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CAD模型

概览

FDZ391P的设计采用飞兆先进的1.5 V PowerTrench工艺和最新“低间距”薄型WLCSP封装工艺，可最大限度地减小PCB空间和R_DS(on)。先进的WLCSP MOSFET彰显了封装技术的突破性进展，使该器件将卓越的传热特性、超薄型封装、低栅极电荷和低r_DS(on)融合为一体。

应用

This product is general usage and suitable for many different applications.
Battery Management
Load Switch
Battery Protection

特性

V_GS = -4.5 V，I_D = -1 A时，最大R_DS(on) = 85mΩ
V_GS = -3 V，I_D = -1 A时，最大R_DS(on) = 123mΩ
V_GS = -3 V，I_D = -1 A时，最大R_DS(on) = 200mΩ
只占用1.5 mm2的PCB面积
超薄封装：安装在PCB上时高度低于0.4 mm
符合RoHS标准

物质成分

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状态

CAD Models

Compliance

Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

V_(BR)DSS Min (V)

R_DS(on) Max @ V_GS = 10 V (mΩ)

Channel Polarity

Configuration

V_GS Max (V)

V_GS(th) Max (V)

I_D Max (A)

P_D Max (W)

R_DS(on) Max @ V_GS = 2.5 V (mΩ)

R_DS(on) Max @ V_GS = 4.5 V (mΩ)

Q_g Typ @ V_GS = 4.5 V (nC)

Q_g Typ @ V_GS = 10 V (nC)

C_iss Typ (pF)

Reference Price

FDZ391P

Obsolete

WLCSP-4

567PT

260

REEL

5000

-20

P-Channel

Single

-1.5

-3

1.9

123

800

Price N/A

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MOSFETs | FDZ391P

-20V P沟道1.5 V PowerTrench®薄型WL-CSP MOSFET

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