Small Signal MOSFETs | NTHS4166N

单 N 沟道，ChipFET™，功率 MOSFET，30V，8.2A，24mΩ

Obsolete

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概览

功率 MOSFET，30V，8.2A，单 N 沟道，ChipFET™ 封装

  • DC-DC Conversion
  • Load/Power Switch
  • Low Side Switching

  • Notebook PC, Printer, Cell Phone, PMP, DSC, GPS, Portable Games

  • Trench Technology
  • Low RDS(on) to Minimize Conduction Losses
  • Leadless ChipFET™ Package has 40% Smaller Footprint than TSOP-6
  • Excellent Thermal Capabilities

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状态

CAD Models

Compliance

Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Channel Polarity

Silicon Family

Package Name

Type

Gate Level

Wide SOA Mosfets

Configuration

OPN in older Technology

V(BR)DSS Min (V)

RDS(on) Max @ VGS = 10 V (mΩ)

VGS Max (V)

Vgs(th) Max (V)

Id Max (A)

PD Max (W)

RDS(on) Max @ VGS = 2.5 V (mΩ)

RDS(on) Max @ VGS = 4.5 V (mΩ)

Qg Typ @ VGS = 4.5 V (nC)

Qg Typ @ VGS = 10 V (nC)

Ciss Typ (pF)

Qgd Typ @ VGS = 4.5 V (nC)

Qrr Typ (nC)

Coss Typ (pF)

Crss Typ (pF)

Reference Price

NTHS4166NT1G

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CAD Model

Pb

A

H

P

ChipFET-8

1206A-03

1

260

REEL

3000

N

N-Channel

PowerTrench® T1

CHIPFET-8

Small Signal

Logic

0

NA

0

30

22

20

2.3

6.6

1.5

-

27

-

9.2

900

3.84

6

210

140

Price N/A

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可靠性数据

Die Related Summary Data

Device: NTHS4166NT1G

Equivalent to wafer fab process: TRENCH FET LEGACY

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等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

TRENCH FET LEGACY

2

15086608915

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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