方案
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此器件专门设计为锂电子电池组保护电路和其他超便携应用中的单封装解决方案。它具有两个共漏极 N 沟道 MOSFET,可实现双向电流流向,基于 Fairchild 先进的 PowerTrench® 工艺以及 MicroFET 导线框架,FDMB2307NZ 可最大程度减小 PCB 空间和 rS1S2(on)。
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CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Channel Polarity
Silicon Family
Package Name
Type
Gate Level
Wide SOA Mosfets
Configuration
OPN in older Technology
V(BR)DSS Min (V)
RDS(on) Max @ VGS = 10 V (mΩ)
VGS Max (V)
Vgs(th) Max (V)
Id Max (A)
PD Max (W)
RDS(on) Max @ VGS = 2.5 V (mΩ)
RDS(on) Max @ VGS = 4.5 V (mΩ)
Qg Typ @ VGS = 4.5 V (nC)
Qg Typ @ VGS = 10 V (nC)
Ciss Typ (pF)
Qgd Typ @ VGS = 4.5 V (nC)
Qrr Typ (nC)
Coss Typ (pF)
Crss Typ (pF)
Reference Price
FDMB2307NZ
Pb
A
H
P
WDFN-6
1
260
REEL
3000
N
N-Channel
PowerTrench® T1
WDFN-6
Small Signal
Logic
0
Dual
0
20
-
12
1.5
9.7
2.2
Q1=Q2=24
Q1=Q2=16.5
4
18
1760
-
-
-
-
Price N/A
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可靠性数据
Die Related Summary Data
Device: FDMB2307NZ
Equivalent to wafer fab process: RN
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
RN
9
5181260142
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)