-20V P沟道1.5V 额定PowerTrench®薄型WL-CSP MOSFET

Obsolete

概览

FDZ197PZ采用飞兆先进的1.5 V PowerTrench®工艺和最新“微间距”WLCSP封装工艺设计,最大限度地减小了PCB空间和rDS(on)。 先进的WLCSP MOSFET彰显了封装技术的突破性进展,使该器件将卓越的传热特性、超薄型封装、低栅极电荷和低rDS(on)融合为一体。

  • This product is general usage and suitable for many different applications.
  • Battery Management
  • Load Switch
  • Battery Protection

  • VGS = -4.5 V,ID = -2.0 A时,最大rDS(on) = 64 mΩ
  • 最大rDS(on) = 71 mmΩ (VGS = -2.5 V, ID= -2.0 A)
  • 最大rDS(on) = 79 mmΩ (VGS = -1.8 V, ID= -1.0 A)
  • 最大rDS(on) = 95 mmΩ (VGS = -1.5 V, ID= -1.0 A)
  • 仅占1.5 mm2的PCB空间。比2 x 2 BGA所占空间少50%。
  • 超薄封装: 安装在PCB上时高度低于0.65 mm
  • ESD保护
  • 符合RoHS标准

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状态

CAD Models

Compliance

Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Channel Polarity

Silicon Family

Package Name

Type

Gate Level

Wide SOA Mosfets

Configuration

OPN in older Technology

V(BR)DSS Min (V)

RDS(on) Max @ VGS = 10 V (mΩ)

VGS Max (V)

Vgs(th) Max (V)

Id Max (A)

PD Max (W)

RDS(on) Max @ VGS = 2.5 V (mΩ)

RDS(on) Max @ VGS = 4.5 V (mΩ)

Qg Typ @ VGS = 4.5 V (nC)

Qg Typ @ VGS = 10 V (nC)

Ciss Typ (pF)

Qgd Typ @ VGS = 4.5 V (nC)

Qrr Typ (nC)

Coss Typ (pF)

Crss Typ (pF)

Reference Price

CAD Model

Pb

A

H

P

WLCSP-6

1

260

REEL

5000

N

P-Channel

PowerTrench® T1

NA

Small Signal

Logic

0

Single

0

-20

64

8

-1

-3.8

1.9

NA

71

11

18

NA

-

-

-

-

Price N/A

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