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此类 N 沟道功率 MOSFET 使用创新的 UltraFET® 工艺生产。此先进工艺技术可实现每单位硅面积最低的导通电阻,从而产生出色的性能。此器件可承受雪崩模式下的高能量,二极管具有很短的逆向恢复时间和极低的存储电荷。它适用于功率能效非常重要的应用,如开关稳压器、开关转换器、电机驱动器、继电器驱动器、低压总线开关,以及便携式和电池运行产品中的功率管理。
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状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Channel Polarity
Silicon Family
Package Name
Type
Gate Level
Wide SOA Mosfets
Configuration
OPN in older Technology
V(BR)DSS Min (V)
RDS(on) Max @ VGS = 10 V (mΩ)
VGS Max (V)
Vgs(th) Max (V)
Id Max (A)
PD Max (W)
RDS(on) Max @ VGS = 2.5 V (mΩ)
RDS(on) Max @ VGS = 4.5 V (mΩ)
Qg Typ @ VGS = 4.5 V (nC)
Qg Typ @ VGS = 10 V (nC)
Ciss Typ (pF)
Qgd Typ @ VGS = 4.5 V (nC)
Qrr Typ (nC)
Coss Typ (pF)
Crss Typ (pF)
Reference Price
HUFA76413DK8T-F085
Pb
A
H
P
SOIC-8
1
260
REEL
2500
N
N-Channel
PowerTrench® T1
SOIC-8
Small Signal
Logic
0
Single
0
60
49
±16
3
5.1
2.5
NA
-
10
18
NA
5
55
180
30
Price N/A
More Details
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可靠性数据
Die Related Summary Data
Device: HUFA76413DK8T-F085
Equivalent to wafer fab process: U2
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
U2
0
3282858009
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)