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FSBB30CH60C是安森美新开发的先进Motion SPM®3系列,用于为空调等小功率应用中的交流电机驱动提供非常紧凑且高性能的逆变器。它结合了优化的电路保护,以及与低损耗IGBT匹配的驱动。集成的欠电压锁定和过电流保护进一步增强了系统可靠性。内置高速HVIC提供了无光耦单电源IGBT栅极驱动,进一步减小了逆变器系统的整体尺寸。三个单独的负直流端子,让逆变器的每个相脚电流均可得到监控。
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MSL Temp (°C)
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Type
Substrate
Input Logic
Rated Voltage Min (V)
IO @ 25 °C Min (A)
VCE(sat) @ 25 °C Typ (V)
RDS(on) (Ω)
Emitter Configuration
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FSBB30CH60C
Pb
A
H
P
DIP-027
NA
0
TUBE
60
Y
SPM3V
3-Phase Inverter IGBT
DBC
Active High
600
30
2
~NA~
3 Emitter Pins
Yes
DIP
$16.5561
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可靠性数据
Die Related Summary Data
Device: FSBB30CH60C
Equivalent to wafer fab process: 03,3B,40,IL
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
03,3B,40,IL
0
206749385
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)