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FSBS10CH60 是飞兆半导体开发的 Motion SPM® 3 系列产品,为低功率应用(如空调和洗衣机)中的交流电机驱动提供非常紧凑且高性能的逆变器解决方案。 它结合了优化后的电路保护功能及与低损耗IGBT相匹配的驱动功能。 集成欠压闭锁和过流保护,进一步增强了系统的可靠性。 高速内置HVIC提供了无光电耦合器、单电源IGBT栅极驱动能力,进一步减小了逆变器系统的整体尺寸。 由于采用三个独立负直流端子,可实现对逆变器每个相位支路电流的监控。
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CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
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Container Qty.
ON Target
Family
Type
Substrate
Input Logic
Rated Voltage Min (V)
IO @ 25 °C Min (A)
VCE(sat) @ 25 °C Typ (V)
RDS(on) (Ω)
Emitter Configuration
Shutdown Pin
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Reference Price
FSBS10CH60
Pb
A
H
P
CDIP-027
NA
0
TUBE
60
N
SPM3V
3-Phase Inverter IGBT
Ceramic
Active High
600
10
2.3
-
3 Emitter Pins
Yes
DIP
Price N/A
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可靠性数据
Die Related Summary Data
Device: FSBS10CH60
Equivalent to wafer fab process: 03,3B,40,IL
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
03,3B,40,IL
0
206749385
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)