This ultrafast rectifier in the dual flag SO−8 flat lead package offersdesigners a unique degree of versatility and design freedom. The twodevices are electrically independent and can be used separately, ascommon cathode, as common anode or in series as a function of boardlevel layout. The exposed pad design provides low thermal resistance.The clip attach design creates a package with very efficient die size toboard area ratio. While thermal performance is nearly the same as theDPAK package height and board footprint are less than half
搜寻
Close Search
产品:
2
分享
排序方式
产品系列:
┗
可订购器件:
2
产品
状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Type
IO(rec) Max (A)
trr Max (ns)
VRRM Max (V)
VFM Max (V)
IFSM Max (A)
IR Max (mA)
参考价格
Show More
1-25 of 25
Products per page
Jump to :
支持服务
联系安森美销售团队获得支持,查询或者对比产品细节。
联系销售
分享
导出
Rows
Printer Friendly Version
PDF Format
Excel Format
CSV Format
To proceed order you need to accept Terms
可靠性数据
Die Related Summary Data
Device: NRVHP620MFDT1G
Equivalent to wafer fab process: RECT
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
RECT
8
30338862575
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)