Schottky Diodes & Schottky Rectifiers | MBRB3030CTL

肖特基势垒整流器，30 V，30 A

Obsolete

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概览

此肖特基整流器运用肖特基势垒原理，采用专属势垒金属。

  • Dual Diode Construction - May be Paralleled for Higher Current Output
  • Guardring for Stress Protection
  • Low Forward Voltage Drop
  • 125?C Operating Junction Temperature
  • Maximum Die Size
  • Short Heat Sink Tab Manufactured - Not Sheared!
  • These are Pb-Free Packages
  • AEC-Q101 Qualified and PPAP Capable
  • NRVBB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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MSL Type

MSL Temp (°C)

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Container Qty.

ON Target

Configuration

VRRM Min (V)

VF Max (V)

IRM Max (µA)

IO(rec) Max (A)

IFSM Max (A)

trr Max (ns)

Cj Max (pF)

Reference Price

MBRB3030CTLG

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Obsolete

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CAD Model

Pb

A

H

P

D2PAK-3 / TO-263-2

418B-04

1

260

TUBE

50

N

Common Cathode

30

0.51

2000

30

300

-

-

Price N/A

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可靠性数据

Die Related Summary Data

Device: MBRB3030CTLG

Equivalent to wafer fab process: RECT

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等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

RECT

3

19108175705

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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