Schottky Diodes & Schottky Rectifiers | MBR0530T3G

肖特基功率整流器，表面贴装，0.5 A，30 V

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该肖特基整流器运用肖特基势垒原理，采用大面积金属-硅功率二极管。该器件适用于低电压、高频率整流，或采用表面贴装的续流和极性保护二极管的应用，其中紧凑的尺寸和重量对系统至关重要。

  • Guardring for Stress Protection
  • Low Forward Voltage
  • 125 C Operating Junction Temperature
  • Epoxy Meets UL94, VO at 1/8"
  • Package Designed for Optimal Automated Board Assembly

    Mechanical Characteristics:
  • Reel Options:
    MBR0530T1 = 3,000 per 7" reel/8 mm tape
    MBR0530T3 = 10,000 per 13" reel/8 mm tape
  • Device Marking: B3
  • Polarity Designator: Cathode Band
  • Weight: 11.7 mg (approximately)
  • Case: Epoxy, Molded
  • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
  • Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds
  • All Packages are Pb-Free
  • NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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MBR0530T3G

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CAD Model

Pb

A

H

P

SOD-123

425-04

1

260

REEL

10000

N

Single

30

0.43

130

0.5

5.5

-

-

$0.034

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可靠性数据

Die Related Summary Data

Device: MBR0530T3G

Equivalent to wafer fab process: RECT

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等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

RECT

3

19108175705

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Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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