Schottky Diodes & Schottky Rectifiers | MBR745

肖特基势垒整流器，7.5 A，45 V

量产中

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概览

此肖特基整流器运用肖特基势垒原理，采用铂金势垒金属。

  • Guardring for Stress Protection
  • Low Forward Voltage
  • 150 C Operating Junction Temperature
  • Epoxy Meets UL94, VO at 1/8"

    Mechanical Characteristics:
  • Case: Epoxy, Molded
  • Weight: 1.9 grams (approximately)
  • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
  • Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds
  • Pb-Free Packages are Available

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Configuration

VRRM Min (V)

VF Max (V)

IRM Max (µA)

IO(rec) Max (A)

IFSM Max (A)

trr Max (ns)

Cj Max (pF)

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参考价格

MBR745G

联系销售

量产中

CAD Model

Pb

A

H

P

TO-220-2

221B-04

NA

0

TUBE

50

No

Single

45

0.84

10

7.5

150

-

-

-

9.97 x 15.43 x 4.44

$0.392

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可靠性数据

Die Related Summary Data

Device: MBR745G

Equivalent to wafer fab process: RECT

产品技术

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等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

RECT

8

30338862575

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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