Schottky Diodes & Schottky Rectifiers | MBRB3030CTL

肖特基势垒整流器，30 V，30 A

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概览

此肖特基整流器运用肖特基势垒原理，采用专属势垒金属。

  • Dual Diode Construction - May be Paralleled for Higher Current Output
  • Guardring for Stress Protection
  • Low Forward Voltage Drop
  • 125?C Operating Junction Temperature
  • Maximum Die Size
  • Short Heat Sink Tab Manufactured - Not Sheared!
  • These are Pb-Free Packages
  • AEC-Q101 Qualified and PPAP Capable
  • NRVBB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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Case Outline

MSL Type

MSL Temp (°C)

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ON Target

Configuration

VRRM Min (V)

VF Max (V)

IRM Max (µA)

IO(rec) Max (A)

IFSM Max (A)

trr Max (ns)

Cj Max (pF)

Package Size (mm)

参考价格

MBRB3030CTLG

联系销售

已停产

CAD Model

Pb

A

H

P

D2PAK-3 / TO-263-2

418B-04

1

260

TUBE

50

No

Common Cathode

30

0.51

2000

30

300

-

-

Price N/A

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可靠性数据

Die Related Summary Data

Device: MBRB3030CTLG

Equivalent to wafer fab process: RECT

产品技术

产品技术

等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

RECT

8

30338862575

More Details

Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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