该肖特基整流器运用肖特基势垒原理,采用势垒金属和外延结构,可产生优化的正向压降-逆向电流权衡。这种先进的封装技术可用于实现高能效的微型、节省空间的表面贴装整流器。Powermite 依托独特的散热设计,热性能与 SMA 相同,占地面积却小 50%。因为其尺寸较小,因而非常适合蜂窝电话、无绳电话、充电器、笔记本电脑、打印机、PDA 和 PCMCIA 卡等便携式和电池供电产品。典型应用为 AC-DC 和 DC-DC 转换器、逆向电池保护和多个供应电压的“OR”操作,以及性能和尺寸性能至关重要的其他应用。
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CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
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Container Qty.
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Configuration
VRRM Min (V)
VF Max (V)
IRM Max (µA)
IO(rec) Max (A)
IFSM Max (A)
trr Max (ns)
Cj Max (pF)
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MBRM2H100T3G
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可靠性数据
Die Related Summary Data
Device: MBRM2H100T3G
Equivalent to wafer fab process: RECT
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
RECT
3
19108175705
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)