Last Shipments
This trench Schottky rectifier in the dual flag SO−8 flat leadpackage offers designers a unique degree of versatility and designfreedom. The two devices are electrically independent and can be usedseparately, as common cathode, as common anode or in series as afunction of board level layout. The exposed pad design provides lowthermal resistance. The clip attach design creates a package with veryefficient die size to board area ratio. While thermal performance isnearly the same as the DPAK package height and board footprint areless than half.Trench Schottky technology provides a superior forward voltage/leakage tradeoff compared to planar Schottky. The reverse switchingcharacteristics are extremely stable over temperature minimizingswitching power loss in high frequency applications.
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Last Shipments
Pb
A
H
P
SO-8FL Dual / DFN-8
1
260
REEL
1500
No
Single
60
0.75
55
6
80
~NA~
~NA~
Price N/A
More Details
已停产
Pb
A
H
P
SO-8FL Dual / DFN-8
1
260
REEL
5000
No
Single
60
0.75
55
6
80
~NA~
~NA~
Price N/A
More Details
已停产
Pb
A
H
P
SO-8FL Dual / DFN-8
1
260
REEL
1500
No
Single
60
0.75
55
6
80
~NA~
~NA~
Price N/A
More Details
已停产
Pb
A
H
P
SO-8FL Dual / DFN-8
1
260
REEL
5000
No
Single
60
0.75
55
6
80
~NA~
~NA~
Price N/A
More Details
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可靠性数据
Die Related Summary Data
Device: NRVTS660MFDT1G
Equivalent to wafer fab process: TRENCH FET LEGACY
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
TRENCH FET LEGACY
5
25938380737
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)