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NRVTSM260 是我们的全新 2A 60V 极低漏沟槽肖特基整流器。 此新型技术可实现更低的正向电压降,而且不会发生平面肖特基整流器出现的高逆向泄漏。 此平台还基于宽温度范围提供非常稳定的开关特性,是用于开关电源的理想输出整流器。
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Case Outline
MSL Type
MSL Temp (°C)
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Configuration
VRRM Min (V)
VF Max (V)
IRM Max (µA)
IO(rec) Max (A)
IFSM Max (A)
trr Max (ns)
Cj Max (pF)
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NRVTSM260ET1G
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NRVTSM260ET3G
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可靠性数据
Die Related Summary Data
Device: NRVTSM260ET1G
Equivalent to wafer fab process: TRENCH FET LEGACY
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
TRENCH FET LEGACY
2
15086608915
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)