碳化硅(SiC)肖特基二极管650V 4A D2PAK封装
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碳化硅肖特基二极管采用全新工艺技术,相较于硅基款,能够带来更加优越的开关性能和更高的可靠度。碳化硅没有反向恢复电流、不受温度影响的开关特性和出色的热性能,使其成为下一代功率半导体的不二选择,为系统带来更高的效率、更快的工作频率、更高的功率密度、更低的EMI,以及更小的系统尺寸和成本。
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D2PAK2 (TO-263-2L)
1
260
REEL
800
N
D1
Single
650
4
1.75
38
200
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可靠性数据
Die Related Summary Data
Device: FFSB0465A
Equivalent to wafer fab process: SIC
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
SIC
0
3855921070
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)