高性能 SPDT 模拟开关,耐过电压
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FSA3051 是一款 6 Ώ、双向、低功耗、两端口、高速、单刀双掷 (SPDT) 模拟开关。它具有 7.7 pF 的极低导通电容 (CON) 和 1.0 GHz 的宽带宽。FSA3051 在该开关 I/O 引脚上包含了特殊电路,用于 VCC 供电断电 (VCC=0) 的应用,使得该器件能够抵御过电压情况。此器件针对最大程度减小电流耗量而设计,即使应用到选择 (S) 引脚的控制电压低于电源电压 (VCC) 时也是如此。此功能在蜂窝电话等超便携应用中尤其有用;可直接接口基带处理器的通用 I/O。其他应用包括移动蜂窝电话、PDA、数码相机、打印机和笔记本电脑中的开关。
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ron Max (Ω)
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Die Related Summary Data
Device: FSA3051TMX-F147
Equivalent to wafer fab process: CM
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平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CM
0
273774116
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Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)