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技术文档和设计资源 数据表 (1) 符合性报告 (3) 封装图纸 (2)
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可订购器件:
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产品
状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Data Rate
VCC (Min) (V)
VCC (Max) (V)
Channels
CTR (Min) (%)
CTR (Max) (%)
CTR Tested @IF
VOL (Max) (V)
ICCL (Max) (mA)
ton (Max) (µs)
toff (Max) (µs)
CMR (Typ) (kV/µs)
VISO (Min) (V)
TOPR (Min) (°C)
TOPR (Max) (°C)
Reference Price
HCPL2530
Obsolete
Pb
A
H
P
PDIP-8
NA
0
TUBE
1000
N
1
-0.5
30
2
7
50
16
0.5
0.4
1.5
1.5
10
2500
-55
100
Price N/A
More Details
HCPL2530S
Obsolete
Pb
A
H
P
PDIP-8 GW
1
225
BLKBG
1000
N
1
-0.5
30
2
7
50
16
0.5
0.4
1.5
1.5
10
2500
-55
100
Price N/A
More Details
HCPL2530SD
Obsolete
Pb
A
H
P
PDIP-8 GW
1
225
REEL
1000
N
1
-0.5
30
2
7
50
16
0.5
0.4
1.5
1.5
10
2500
-55
100
Price N/A
More Details
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可靠性数据
Die Related Summary Data
Device: HCPL2530
Equivalent to wafer fab process: BN,GA
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BN,GA
0
252701301
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)