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FODM452和FODM453光电耦合器包含光学耦合至高速光电检测晶体管的AlGaAs LED。 器件封装于一个紧凑型5引脚微型扁平封装,以实现最佳安装密度。 FODM453具有高CMR额定值,以最大程度上防止共用模式瞬态。
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状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Data Rate
VCC (Min) (V)
VCC (Max) (V)
Channels
CTR (Min) (%)
CTR (Max) (%)
CTR Tested @IF
VOL (Max) (V)
ICCL (Max) (mA)
ton (Max) (µs)
toff (Max) (µs)
CMR (Typ) (kV/µs)
VISO (Min) (V)
TOPR (Min) (°C)
TOPR (Max) (°C)
Reference Price
FODM452
Active
Pb
A
H
P
MFP-5
1
260
TUBE
3000
Y
1
-0.5
30
1
20
50
16
0.4
0.2
0.8
0.8
15
3750
-40
85
$0.4109
More Details
FODM452R2
Active
Pb
A
H
P
MFP-5
1
260
REEL
2500
Y
1
-0.5
30
1
20
50
16
0.4
0.2
0.8
0.8
15
3750
-40
85
$0.8313
More Details
FODM452R2V
Active
Pb
A
H
P
MFP-5
1
260
REEL
2500
Y
1
-0.5
30
1
20
50
16
0.4
0.2
0.8
0.8
15
3750
-40
85
$0.4217
More Details
FODM452V
Active
Pb
A
H
P
MFP-5
1
260
TUBE
3000
Y
1
-0.5
30
1
20
50
16
0.4
0.2
0.8
0.8
15
3750
-40
85
$0.7015
More Details
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可靠性数据
Die Related Summary Data
Device: FODM452
Equivalent to wafer fab process: BM,GA
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BM,GA
0
2467474
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)