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HCPL05XX 和 HCPL04XX 光耦合器由于高速光电检测器晶体管进行光耦合的 AlGaAs LED 组成,采用紧凑的 8 引脚小外形封装。用于光电二极管偏置的单独联接降低了输入晶体管的基极-集极电容,与传统光电晶体管相比,速度提高了若干个数量级。HCPL04XX 器件没有与引线结合的基板,可实现更大噪声裕度。HCPL053X 器件每个封装具有两个沟道,具有最佳安装密度。
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MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Data Rate
VCC (Min) (V)
VCC (Max) (V)
Channels
CTR (Min) (%)
CTR (Max) (%)
CTR Tested @IF
VOL (Max) (V)
ICCL (Max) (mA)
ton (Max) (µs)
toff (Max) (µs)
CMR (Typ) (kV/µs)
VISO (Min) (V)
TOPR (Min) (°C)
TOPR (Max) (°C)
Reference Price
HCPL0453
Active
Pb
A
H
P
SOIC-8
1
260
TUBE
3000
Y
1
-0.5
30
1
19
50
16
0.4
0.2
0.8
0.8
40
2500
-40
85
$0.4129
More Details
HCPL0453R2
Active
Pb
A
H
P
SOIC-8
1
260
REEL
2500
Y
1
-0.5
30
1
19
50
16
0.4
0.2
0.8
0.8
40
2500
-40
85
$0.4355
More Details
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可靠性数据
Die Related Summary Data
Device: HCPL0453
Equivalent to wafer fab process: BM,GA
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BM,GA
0
2467474
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)