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HCPL05XX和HCPL04XX光电耦合器包含一个砷化铝镓LED,它光耦合到紧凑型8引脚小尺寸封装中一个高速光电探测器晶体管。
通过降低输入晶体管的基极-集电极电容,单独连接实现光电二极管偏置使速度比传统光电晶体管光电耦合器提高数个级别。 HCPL04XX器件不具有向外焊接到引脚以获得额外噪声容限的基极。 HCPL053X 器件的每种封装具有两个通道,可获得最佳的安装密度。
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状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Data Rate
VCC (Min) (V)
VCC (Max) (V)
Channels
CTR (Min) (%)
CTR (Max) (%)
CTR Tested @IF
VOL (Max) (V)
ICCL (Max) (mA)
ton (Max) (µs)
toff (Max) (µs)
CMR (Typ) (kV/µs)
VISO (Min) (V)
TOPR (Min) (°C)
TOPR (Max) (°C)
Reference Price
HCPL0501
Active
Pb
A
H
P
SOIC-8
1
260
TUBE
3000
N
1
-0.5
30
1
19
50
16
0.4
0.2
0.8
0.8
10
2500
-40
85
$0.4083
More Details
HCPL0501R2
Active
Pb
A
H
P
SOIC-8
1
260
REEL
2500
N
1
-0.5
30
1
19
50
16
0.4
0.2
0.8
0.8
10
2500
-40
85
$0.4304
More Details
HCPL0501R2V
Active
Pb
A
H
P
SOIC-8
1
260
REEL
2500
N
1
-0.5
30
1
19
50
16
0.4
0.2
0.8
0.8
10
2500
-40
85
$0.4393
More Details
HCPL0501V
Last Shipments
Pb
A
H
P
SOIC-8
1
260
TUBE
3000
N
1
-0.5
30
1
19
50
16
0.4
0.2
0.8
0.8
10
2500
-40
85
Price N/A
More Details
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可靠性数据
Die Related Summary Data
Device: HCPL0501R2
Equivalent to wafer fab process: BM,GA
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BM,GA
0
2467474
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)