这些光耦合器由与极高速集成光电检测器逻辑门极光耦合的 AlGaAS LED 组成。这些器件包括一个可调谐输出。此输出具有一个开路集电极,因此允许有线 OR 输出。耦合参数在 -40°C 至 +85°C 的温度范围内可得以保证。最高 5 mA 的输入信号提供最小 13 mA 的输出汲电流(扇出 8)。内部噪声屏蔽提供卓越的共模抑制,在 1,000V 共模下的典型值为 50 kV/µs。
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状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Data Rate
VCC (Max) (V)
VCC (Min) (V)
Channels
IFT (Max) (mA)
CTR (Min) (%)
CTR (Max) (%)
CTR Tested @IF
VOL (Max) (V)
tPHL (Max) (ns)
tPLH (Max) (ns)
PWD (Max) (ns)
CMR (Min) (kV/µs)
VISO (Min) (V)
TOPR (Min) (°C)
TOPR (Max) (°C)
Reference Price
FOD260L
Active
Pb
A
H
P
PDIP-8
NA
0
TUBE
1000
N
10
5.5
3
1
5
-
-
-
0.6
75
90
25
25
5000
-40
85
$0.8447
More Details
FOD260LS
Active
Pb
A
H
P
PDIP-8 GW
1
260
BLKBG
1000
N
10
5.5
3
1
5
-
-
-
0.6
75
90
25
25
5000
-40
85
$0.9361
More Details
FOD260LSD
Active
Pb
A
H
P
PDIP-8 GW
1
260
REEL
1000
N
10
5.5
3
1
5
-
-
-
0.6
75
90
25
25
5000
-40
85
$0.8716
More Details
FOD260LSDV
Active
Pb
A
H
P
PDIP-8 GW
1
260
REEL
1000
N
10
5.5
3
1
5
-
-
-
0.6
75
90
25
25
5000
-40
85
$0.9152
More Details
FOD260LSV
Active
Pb
A
H
P
PDIP-8 GW
1
260
BLKBG
1000
N
10
5.5
3
1
5
-
-
-
0.6
75
90
25
25
5000
-40
85
$0.9152
More Details
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可靠性数据
Die Related Summary Data
Device: FOD260L
Equivalent to wafer fab process: BN,GA
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BN,GA
0
252701301
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)