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FOD8001 是一款 3.3V/5V 高速逻辑门极光耦合器,支持隔离式通信,使得数字信号能够在系统之间进行通信,而无需导通接地回路或危险电压。它利用安森美半导体的专属共面封装技术 Optoplanar® 和优化的集成电路设计来实现高抗扰度,具有高共模抑制和电源抑制规定特性。此高速逻辑门极光耦合器封装在 8 引脚小型封装中,包含一个高速 AlGaAs LED,由与 CMOS 检测集成电路耦合的 CMOS 缓冲集成电路驱动。该检测集成电路包含一个集成光电二极管、一个高速互阻抗放大器和一个带有输出驱动器的电压比较器。该 CMOS 技术与高能效 LED 进行耦合,实现了低能耗以及极高速(40ns 传播延迟、6ns 脉冲宽度失真)。
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Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Data Rate
VCC (Max) (V)
VCC (Min) (V)
Channels
IFT (Max) (mA)
CTR (Min) (%)
CTR (Max) (%)
CTR Tested @IF
VOL (Max) (V)
tPHL (Max) (ns)
tPLH (Max) (ns)
PWD (Max) (ns)
CMR (Min) (kV/µs)
VISO (Min) (V)
TOPR (Min) (°C)
TOPR (Max) (°C)
Reference Price
FOD8001
Active
Pb
A
H
P
SOIC-8
1
260
TUBE
3000
Y
25
5.5
3
1
-
-
-
-
0.1
40
40
6
20
3750
-40
105
$0.7628
More Details
FOD8001R2
Active
Pb
A
H
P
SOIC-8
1
260
REEL
2500
Y
25
5.5
3
1
-
-
-
-
0.1
40
40
6
20
3750
-40
105
$0.7851
More Details
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可靠性数据
Die Related Summary Data
Device: FOD8001
Equivalent to wafer fab process: BB,GA
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BB,GA
0
58865369
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)