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FOD8160 是一款 3.3V/5V 高速逻辑门输出(开路集电极输出)光电耦合器,支持隔离式通信,允许数字信号在不传导接地环路或危险电压的情况下在系统间通信。 该器件采用飞兆专有的 Optoplanar® 共面封装技术,优化了 IC 设计,通过高共模抑制规格特点实现了高抗噪能力。
FOD8160 封装在宽体 SOP 5 引脚封装中,它由一个铝砷化铝镓(AlGaAs)LED 和一个集成式高速光检测器组成。 检测器IC输出是一个开路集电极肖特基箝位晶体管。 电气和开关特性在 -40°C至100°C 的扩展工业温度范围和 3V 至 5.5V 的 VCC 电压范围都能得到保证。
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状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Data Rate
VCC (Max) (V)
VCC (Min) (V)
Channels
IFT (Max) (mA)
CTR (Min) (%)
CTR (Max) (%)
CTR Tested @IF
VOL (Max) (V)
tPHL (Max) (ns)
tPLH (Max) (ns)
PWD (Max) (ns)
CMR (Min) (kV/µs)
VISO (Min) (V)
TOPR (Min) (°C)
TOPR (Max) (°C)
Reference Price
FOD8160
Active
Pb
A
H
P
SOIC5 (6) 3.95x9.20x2.55, 1.27P
1
260
TUBE
2000
Y
10
5.5
3
1
6
-
-
-
0.6
80
90
35
20
5000
-40
100
$1.5597
More Details
FOD8160R2
Active
Pb
A
H
P
SOIC5 (6) 3.95x9.20x2.55, 1.27P
1
260
REEL
1000
Y
10
5.5
3
1
6
-
-
-
0.6
80
90
35
20
5000
-40
100
$1.5597
More Details
FOD8160R2V
Active
Pb
A
H
P
SOIC5 (6) 3.95x9.20x2.55, 1.27P
1
260
REEL
1000
Y
10
5.5
3
1
6
-
-
-
0.6
80
90
35
20
5000
-40
100
$1.3561
More Details
FOD8160V
Active
Pb
A
H
P
SOIC5 (6) 3.95x9.20x2.55, 1.27P
1
260
TUBE
2000
Y
10
5.5
3
1
6
-
-
-
0.6
80
90
35
20
5000
-40
100
$1.5597
More Details
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可靠性数据
Die Related Summary Data
Device: FOD8160
Equivalent to wafer fab process: BN,GA
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BN,GA
0
252701301
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)