Specific Function Optocouplers | H11F1M

6 引脚 DIP 双向模拟 FET 输出光耦合器

Active

数据表

产品

概览

H11FXM 系列由一个与对称双向硅光电检测器耦合的砷铝镓红外发光二极管组成。该检测器可与输入进行电气隔离，就好像一个理想隔离的 FET，适用于低电平交流和直流模拟信号的无失真控制。H11FXM 系列器件安装在双线内封装内。

  • 消费型设备
  • 工业级电机

  • 作为一个远程可变电阻：
  • ≤ 100Ω至≥ 300MΩ
  • ≤ 15pF分流电容
  • ≥ 100GΩ I/O隔离电阻作为模拟开关：
  • 极低失调电压
  • 60 Vpk-pk信号能力
  • 无电荷注入或闩锁
  • UL认证（文件编号E90700）

Tools and Resources

Product services, tools and other useful resources related to H11F1M

CAD Model

CAD模型

物质成分

产品更改通知

可靠性数据

产品列表

如需购买产品或样品，请先登录您的安森美账号。

搜寻

Close Search

产品:

5

分享

排序方式

产品系列:

┗

可订购器件:

5

产品

状态

CAD Models

Compliance

Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

VCC (Max) (V)

VCC (Min) (V)

VOL (Max) (V)

ICCL (Max) (mA)

II (ON) RMS (Min) (mA)

II (OFF) RMS (Max) (mA)

ITH+ (Max) (mA)

ITH- (Max) (mA)

Breakdown Voltage (Min) (V)

Off State Dark Current (Max) (nA)

RON (Max) (Ω)

tPHL, ton (Max) (µs)

tPLH, toff (Max) (µs)

VISO (Min) (V)

TOPR (Min) (°C)

TOPR (Max) (°C)

Reference Price

H11F1M

Contact Sales

Active

CAD Model

Pb

A

H

P

PDIP-6

646BX

NA

0

BLKBG

1000

Y

30

-

-

-

-

0.05

-

-

30

50

200

25

25

7500

-40

100

$0.4413

More Details

H11F1SM

Contact Sales

Active

CAD Model

Pb

A

H

P

PDIP-6

646BY

1

260

BLKBG

1000

Y

30

-

-

-

-

0.05

-

-

30

50

200

25

25

7500

-40

100

$0.4413

More Details

H11F1SR2M

Contact Sales

Active

CAD Model

Pb

A

H

P

PDIP-6

646BY

1

260

BLKBG

1000

Y

30

-

-

-

-

0.05

-

-

30

50

200

25

25

7500

-40

100

$0.4753

More Details

H11F1TVM

Contact Sales

Active

CAD Model

Pb

A

H

P

PDIP-6

646BZ

NA

0

BLKBG

1000

Y

30

-

-

-

-

0.05

-

-

30

50

200

25

25

7500

-40

100

$0.4413

More Details

H11F1VM

Contact Sales

Active

CAD Model

Pb

A

H

P

PDIP-6

646BX

NA

0

BLKBG

1000

Y

30

-

-

-

-

0.05

-

-

30

50

200

25

25

7500

-40

100

$0.4413

More Details

Show More

1-25 of 25

Products per page

Jump to :

1
contact sales icon

Support on the go

Find and compare products, get support and connect with onsemi sales team.

可靠性数据

Die Related Summary Data

Device: H11F1M

Equivalent to wafer fab process: BN,GA

产品技术

产品技术

等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

BN,GA

0

252701301

More Details

Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

重新搜寻