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HCPL3700M 电压/电流阈值检测光耦合器包括一个联接阈值感应输入缓冲集成电路的 AlGaAs LED,该集成电路与高增益达灵顿输出进行光耦合。输入缓冲芯片能够使用单个电阻在较宽的输入电压范围内控制阈值水平。该输出可兼容 TTL 和 CMOS。
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Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
VCC (Max) (V)
VCC (Min) (V)
VOL (Max) (V)
ICCL (Max) (mA)
II (ON) RMS (Min) (mA)
II (OFF) RMS (Max) (mA)
ITH+ (Max) (mA)
ITH- (Max) (mA)
Breakdown Voltage (Min) (V)
Off State Dark Current (Max) (nA)
RON (Max) (Ω)
tPHL, ton (Max) (µs)
tPLH, toff (Max) (µs)
VISO (Min) (V)
TOPR (Min) (°C)
TOPR (Max) (°C)
Reference Price
HCPL3700M
Active
Pb
A
H
P
PDIP-8
NA
0
TUBE
1000
Y
18
2
0.4
4
-
-
3.11
1.62
-
-
10
15
40
5000
-40
85
$1.0209
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HCPL3700SDM
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HCPL3700SDVM
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HCPL3700SM
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HCPL3700SVM
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HCPL3700VM
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可靠性数据
Die Related Summary Data
Device: HCPL3700M
Equivalent to wafer fab process: BN,GA
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BN,GA
0
252701301
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)