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FODM100x 系列单沟道直流感应输入光耦合器采用拉伸体 SOP 4 引脚封装,其中包含一个砷化镓 (GaAs) 红外发光二极管,它与一个光电晶体管进行光耦合。输入-输出隔离电压 VISO 额定值为 5,000 VACRMS。
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MSL Temp (°C)
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CTR (Min) (%)
CTR (Max) (%)
CTR tested @ IF (mA)
VCE(sat) (Max) (V)
BVCEO (Min) (V)
BVCBO (Min) (V)
BVECO (Min) (V)
ton (Max) (µs)
toff (Max) (µs)
VISO (Min) (V)
TOPR (Min) (°C)
TOPR (Max) (°C)
Reference Price
FODM1007
Active
Pb
A
H
P
SSOP-4 / LSOP-4
1
260
TUBE
2000
N
1
80
160
5
0.3
70
-
7
-
-
5000
-40
110
$0.1611
More Details
FODM1007R2
Active
Pb
A
H
P
SSOP-4 / LSOP-4
1
260
REEL
3000
N
1
80
160
5
0.3
70
-
7
-
-
5000
-40
110
$0.1713
More Details
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可靠性数据
Die Related Summary Data
Device: FODM1007
Equivalent to wafer fab process: PD
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
PD
0
206924763
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)